{"apiVersion":"2.155","reference":"51665394TOPICSen","url":"https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/DIGITAL-JU-CHIPS-2026-SG-JAPAN","contentType":"text/plain","language":"en","databaseLabel":"SEDIA","database":"SEDIA","summary":"International collaboration EU and Japan on semiconductors","weight":1.0,"groupById":"1","content":"International collaboration EU and Japan on semiconductors","accessRestriction":false,"checksum":"EAB25DF9266FB968E11DA85D4519655C211D6FE331CFCF911D37D32A53456611","metadata":{"latestInfos":["[{\"approvalDate\":\"\",\"lastChangeDate\":\"2026-09-23T15:57:45.757\",\"content\":\"\\u003cp\\u003e\\u003cstrong\\u003eIMPORTANT UPDATE : \\u003c/strong\\u003e\\u003c/p\\u003e\\u003cp\\u003ePlease note that the deadline for the DIGITAL-JU-Chips-2026-SG-JAPAN call has been postponed. \\u003c/p\\u003e\\u003cp\\u003eThe new deadline is now \\u003cstrong\\u003eDecember 8th, 2026\\u003c/strong\\u003e (originally September 24th, 2026).\\u003c/p\\u003e\"},{\"approvalDate\":\"\",\"lastChangeDate\":\"2026-07-07T00:01:03.881\",\"content\":\"The submission session is now available for: DIGITAL-JU-CHIPS-2026-SG-JAPAN\"}]"],"es_SortDate":["2026-07-07T00:00:00.000+0000"],"sepTemplate":["<p>To access the Electronic Submission Service, please click on the submission-button next to the <strong>type of action</strong> and the <strong>type of model grant agreement</strong> that corresponds to your proposal. You will then be asked to confirm your choice, as it cannot be changed in the submission system. Upon confirmation, you will be linked to the correct entry point.</p><p>To access existing draft proposals for this topic, please login to the Funding &amp; Tenders Portal and select the My Proposals page of the My Area section.</p>"],"keywords":["DIGITAL-JU-CHIPS-2026-SG-JAPAN","DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"sortStatus":["1"],"language":["en"],"topicConditions":["<div class=\"eui-u-mt-l>\"><h4>Conditions</h4><div><h4>1. Admissibility conditions: Proposal page limit and layout</h4><div class=\"eui-u-mt-s\"><p>described in <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> <u>call document</u>.</p><p><strong>Proposal page limits and layout:</strong> described in Part B of the Application Form available in the Submission System.</p></div></div><div><h4>2. Eligible countries</h4><div class=\"eui-u-mt-s\"><p>described in <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>3. Other eligibility conditions</h4><div class=\"eui-u-mt-s\"><p><u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>4. Financial and operational capacity and exclusion</h4><div class=\"eui-u-mt-s\"><p>described <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5a. Evaluation and award: Submission and evaluation processes</h4><div class=\"eui-u-mt-s\"><p>described <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u> and the <a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/om_en.pdf\" rel=\"noopener noreferrer\" target=\"_blank\">Online Manual</a>.</p></div></div><div><h4>5b. Evaluation and award: Award criteria, scoring and thresholds</h4><div class=\"eui-u-mt-s\"><p>described <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>5c. Evaluation and award: Indicative timeline for evaluation and grant agreement</h4><div class=\"eui-u-mt-s\"><p>described in <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div><div><h4>6. Legal and financial set-up of the grants</h4><div class=\"eui-u-mt-s\"><p>described <u><a href=\"https://www.chips-ju.europa.eu/viewfile/?id=a8627a97-955e-f111-a826-000d3a27d474\" rel=\"noopener noreferrer\" target=\"_blank\">Appendix 8 of Work Programme - Chips for Europe Initiative</a></u>.</p></div></div></div><div class=\"eui-u-mt-l\"><div class=\"eui-u-mt-s\"><p><a href=\"https://www.chips-ju.europa.eu/Call-Details/?id=a1c5feaf-d070-f111-ab0e-000d3ab6c0a4\" rel=\"noopener noreferrer\" target=\"_blank\">Call Details</a></p></div><h4>Call document and annexes:</h4> <div class=\"eui-u-mt-s\"><p><strong>Model Grant Agreements (MGA)</strong></p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/digital/agr-contr/mga_dep_en.pdf\" rel=\"noopener noreferrer\" target=\"_blank\">DEP MGA</a></p></div><h4>Additional documents:</h4> <div class=\"eui-u-mt-s\"><p><a href=\"https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=CELEX:32021R0694\" rel=\"noopener noreferrer\" target=\"_blank\">DEP Regulation 2021/964</a></p><p><a href=\"https://eur-lex.europa.eu/legal-content/EN/ALL/?uri=OJ:L_202402509\" rel=\"noopener noreferrer\" target=\"_blank\">EU Financial Regulation 2024/2509</a></p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/guidance/aga_en.pdf\" rel=\"noopener noreferrer\" target=\"_blank\">EU Grants AGA — Annotated Model Grant Agreement</a> </p><p><a href=\"https://webgate.ec.europa.eu/funding-tenders-opportunities/display/OM/Online+Manual\" rel=\"noopener noreferrer\" target=\"_blank\">Funding &amp; Tenders Portal Online Manual</a> </p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/docs/2021-2027/common/ftp/tc_en.pdf\" rel=\"noopener noreferrer\" target=\"_blank\">Funding &amp; Tenders Portal Terms and Conditions</a> </p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/legalnotice\" rel=\"noopener noreferrer\" target=\"_blank\">Funding &amp; Tenders Portal Privacy Statement</a></p></div></div>"],"title":["International collaboration EU and Japan on semiconductors"],"type":["1"],"esST_checksum":["EAB25DF9266FB968E11DA85D4519655C211D6FE331CFCF911D37D32A53456611"],"focusArea":[],"esST_FileName":["file.txt"],"typeOfMGAs":["43140990"],"callIdentifier":["DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"ccm2Id":["51665394"],"callccm2Id":["51665404"],"DATASOURCE":["SEDIA"],"REFERENCE":["51665394TOPICSen"],"links":["[{\"callIdentifier\":\"DIGITAL-JU-CHIPS-2026-SG-JAPAN\",\"criterionCode\":\"DIGITAL-JU-SIMPLE\",\"criterionDescription\":\"DIGITAL JU Simple Grants\",\"url\":\"https://ec.europa.eu/research/participants/submission/manage/screen/submission/create-draft/45451?topic\\u003dDIGITAL-JU-CHIPS-2026-SG-JAPAN\",\"startDate\":\"1783382400000\",\"endDate\":\"1790208000000\",\"mgaDescription\":\"DIGITAL Action Grant Budget-Based\",\"mgaCode\":\"DIGITAL-AG\"}]"],"callTitle":["DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"frameworkProgramme":["43152860"],"descriptionByte":["<p class=\"topicdescriptionkind\">Expected Outcome:</p><p>Projects are expected to contribute to the following expected outcomes:</p><ul level=\"0\"><li> <p>Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.</p> </li><li> <p>Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem</p> </li> </ul><p> Expected outcomes should have direct and immediate impact on European industry.</p><p>Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.</p>"],"identifier":["DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"es_ContentType":["text/plain"],"programmeDivision":["43152869"],"crossCuttingPriorities":["DigitalAgenda"],"esDA_FirstIngestDate":["2026-07-07T00:01:21.101+0200"],"programmePeriod":["2021 - 2027"],"deadlineDate":["2026-12-08T00:00:00.000+0000"],"esDA_IngestDate":["2026-09-23T16:56:53.682+0200"],"typesOfAction":["DIGITAL JU Simple Grants"],"url":["https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"es_Combine":["1"],"esST_URL":["https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/DIGITAL-JU-CHIPS-2026-SG-JAPAN"],"tags":[],"cenTagsA":["TOPICS-007584","TOPICS-061999"],"esDA_QueueDate":["2026-09-23T16:56:53.675+0200"],"actions":["[{\"types\":[{\"typeOfAction\":\"DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants\",\"typeOfMGA\":[{\"id\":43140990,\"abbreviation\":\"DIGITAL-AG\",\"description\":\"DIGITAL Action Grant Budget-Based\"}]}],\"status\":{\"id\":31094502,\"abbreviation\":\"Open\",\"description\":\"Open\"},\"plannedOpeningDate\":\"2026-07-07\",\"submissionProcedure\":{\"id\":31094504,\"abbreviation\":\"single-stage\",\"description\":\"single-stage\"},\"deadlineDates\":[\"2026-12-08\"]}]"],"allowPartnerSearch":["true"],"budgetOverview":["{\"budgetYearsColumns\":[\"2026\"],\"budgetTopicActionMap\":{\"115261\":[{\"action\":\"DIGITAL-JU-CHIPS-2026-SG-JAPAN - DIGITAL-JU-SIMPLE DIGITAL JU Simple Grants\",\"expectedGrants\":2,\"minContribution\":3000000,\"maxContribution\":5000000,\"budgetYearMap\":{\"2026\":\"5000000\"},\"plannedOpeningDate\":\"2026-07-07\",\"deadlineModel\":\"single-stage\",\"deadlineDates\":[\"2026-12-08\"]}]}}"],"startDate":["2026-07-07T00:00:00.000+0000"],"deadlineModel":["single-stage"],"specificObjective":["SO6"],"supportInfo":["<p>For help related to this call, please contact: <a href=\"mailto:Calls@chips-ju.europa.eu\" rel=\"noopener noreferrer\" target=\"_blank\">Calls@chips-ju.europa.eu</a></p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/faq?order=DESC&amp;pageNumber=1&amp;pageSize=10&amp;sortBy=publicationDate&amp;isExactMatch=true&amp;type=1&amp;grantCategories=p_submission_eval\" rel=\"noopener noreferrer\" target=\"_blank\">Funding &amp; Tenders Portal FAQ – Submission of proposals</a>.</p><p><a href=\"https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/support/helpdesks/contact-form\" rel=\"noopener noreferrer\" target=\"_blank\">IT Helpdesk</a> – Contact the IT helpdesk for questions such as forgotten passwords, access rights and roles, technical aspects of submission of proposals, etc.</p><p><a href=\"https://webgate.ec.europa.eu/funding-tenders-opportunities/display/OM/Online+Manual\" rel=\"noopener noreferrer\" target=\"_blank\">Online Manual</a> – Step-by-step online guide through the Portal processes from proposal preparation and evaluation to reporting on your ongoing project. Valid for all 2021-2027 programmes.</p>"],"status":["31094502"]},"enrichedMetadata":{},"children":[],"highlightedFragments":[],"citation":"International collaboration EU and Japan on semiconductors. Available at: https://ec.europa.eu/info/funding-tenders/opportunities/portal/screen/opportunities/topic-details/DIGITAL-JU-CHIPS-2026-SG-JAPAN"}